Samsung reveals HBM5 specs, to use copper-based HPB cooling tech

Samsung Electronics plans to produce HBM5 memory using its proprietary 2nm process, with mass production targeted for around 2028. A key feature will be the large-scale application of Heat Pipe Block (HPB) technology for thermal management. HPB is a metal heat-conducting structure integrated within the chip package, primarily made from copper-based materials. It is reported to have thermal conductivity approximately 500 to 1,000 times higher than polymer-based materials like substrates, die attach films (DAF), and epoxy molding compounds (EMC).